lsrfvy3392/r1-pf data sheet doc. no : qw0905-lsrfvy3392/r1-pf rev. : a date : 03 - aug. - 2007 ligitek electronics co.,ltd. property of ligitek only lead-free parts pb dual color led lamps
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only page 1/6 package dimensions part no. lsrfvy3392/r1-pf 18.0min 1 2 3 2.0min 0.5 typ 2.54typ 2.54typ 2.0min 1.cathode yellow 2.common anode 3.cathode red 3 2 1 - + - 1.5max 5.9 5.0 10.5 0.5 8.6 7.6 vy srf 50% 100%75% -30 -60 50% 0 25%25%100% 75% 30 60 0 directivity radiation
i f forward current 30 ma 30 power dissipation peak forward current duty 1/10@10khz reverse current @5v storage temperature part no typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. lsrfvy3392/r1-pf operating temperature spectral halfwidth nm 20 20 color white diffused algainp algainp red yellow material emitted 590 630 lens dominant wave length dnm 2.4 2.6 1.5 1.7 9.0 15 15 28 forward voltage @20ma(v) max. min. luminous intensity @20ma(mcd) min. typ. 76 76 viewing angle 2 1/2 (deg) -40 ~ +100 -40 ~ +85 tstg t opr pd ir i fp 75 90 ma mw a 60 75 10 absolute maximum ratings at ta=25 ratings ligitek electronics co.,ltd. property of ligitek only parameter symbol srf unit page vy 2/6 electrostatic discharge( * ) esd2000 v static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. lsrfvy3392/r1-pf
ambient temperature( ) fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -2020 04060 0.9 1.0 1.2 1.1 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.0 80100-40-20 020 3.0 2.5 2.0 1.0 1.5 0.5 100 60 4080 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage srf chip f o r w a r d c u r r e n t ( m a ) forward voltage(v) 0.1 1.02.0 1.0 10 3.04.0 100 1000 forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.5 1.0 0.5 0.0 5.01.010 3.0 2.5 2.0 1001000 ligitek electronics co.,ltd. property of ligitek only fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 550 0.0 0.5 650 1.0 700 3/6 page part no. lsrfvy3392/r1-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 0.1 1.0 10 100 1000 1.0101001000 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vy chip 4/6 page 3.0 2.5 2.0 1.5 1.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 part no. lsrfvy3392/r1-pf
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. preheat 0 0 25 2 /sec max 50 time(sec) 100 150 260 c3sec max 260 temp( c) 5 /sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. lsrfvy3392/r1-pf
6/6 page the purpose of this test is the resistance of the device under tropical for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test reliability test: test condition operating life test test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard part no. lsrfvy3392/r1-pf
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